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SHINKAWA  MP-2S  金相试样磨抛机 成都阳光熹禾

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  • 型号:MP-2S
  • 品牌:SHINKAWA
  • 功能:触摸屏控制,用于金相试样的粗磨、精磨和抛光操作
  • 特点:无极调速和四档定速功能,冷却装置设计,定时功能、正转反转和中英值转换功能
  • 应用领域:金属加工、光电子、模具加工、半导体制造等行业
  • 操作界面:友好的触摸屏控制技术,便于用户操作和调整
  • 电话/Phone:17350011025 (微信同号)
  • 邮箱/Email:1713556114@qq.com
  • QQ:1713556114

产品细节说明:MP-2S  SHINKAWA 金相试样磨抛机

SHINKAWA MP-2S 是由日本SHINKAWA公司生产的一款高性能的金相试样磨抛机,具备触摸屏控制功能,能够进行金相试样的粗磨、精磨和抛光操作 。它采用了先进的触摸屏显示技术,操作简便,用户界面友好,适合在工厂、科研单位或大专院校实验室中使用 。MP-2S磨抛机具备无极调速和四档定速功能,可以自动调节磨抛力度,确保试样的制备质量 。此外,该设备还具备定时功能、正转反转和中英值转换功能,为用户提供了更多的操作选择和便利 。MP-2S 磨抛机的设计包括冷却装置,能够有效防止试样在磨抛过程中过热,保证试样的完整性和制备效果。它采用了高精度的磨削和抛光头,确保试样的表面光洁度和精度 。此外,该设备还具备转动平稳、噪声小、操作方便、工作效率高等特点

MP-2S

产品详情参数 :MP-2S  SHINKAWA 金相试样磨抛机

  • 型号:MP-2S
  • 品牌:SHINKAWA
  • 功能:触摸屏控制,用于金相试样的粗磨、精磨和抛光操作
  • 特点:无极调速和四档定速功能,冷却装置设计,定时功能、正转反转和中英值转换功能
  • 应用领域:金属加工、光电子、模具加工、半导体制造等行业
  • 操作界面:友好的触摸屏控制技术,便于用户操作和调整

MP-2S  SHINKAWA 应用领域:

SHINKAWA MP-2S 磨抛机广泛应用于金属加工、光电子、模具加工、半导体制造等行业。例如,在汽车制造业中,全自动磨抛机常被用于汽车发动机零部件的加工,如曲轴、连杆等。在航空航天领域,该磨抛机也可以用于飞机零部件的制造,如飞机发动机叶片等 。

Product Details: MP-2S SHINKAWA Metallographic Sample Grinding and Polishing Machine

SHINKAWA MP-2S is a high-performance metallographic sample grinding and polishing machine produced by SHINKAWA Corporation in Japan. It has a touch screen control function and can perform rough grinding, fine grinding, and polishing operations on metallographic samples. It adopts advanced touch screen display technology, is easy to operate, has a user-friendly interface, and is suitable for use in factories, research institutions, or college laboratories. The MP-2S grinding and polishing machine has infinite speed regulation and four speed constant function, which can automatically adjust the grinding and polishing force to ensure the quality of sample preparation. In addition, the device also has timing function, forward and reverse rotation, and Chinese English value conversion function, providing users with more operational choices and convenience. The design of MP-2S grinding and polishing machine includes a cooling device, which can effectively prevent the sample from overheating during the grinding and polishing process, ensuring the integrity and preparation effect of the sample. It adopts high-precision grinding and polishing heads to ensure the surface smoothness and accuracy of the sample. In addition, the device also has the characteristics of smooth rotation, low noise, easy operation, and high work efficiency

Product details and parameters: MP-2S SHINKAWA metallographic sample grinding and polishing machine
Model: MP-2S
Brand: SHINKAWA
Function: Touch screen control, used for rough grinding, fine grinding, and polishing operations of metallographic specimens
Features: Infinite speed regulation and four speed fixed function, cooling device design, timing function, forward and reverse rotation, and Chinese English value conversion function
Application areas: metal processing, optoelectronics, mold processing, semiconductor manufacturing and other industries
User interface: Friendly touch screen control technology, easy for users to operate and adjust
MP-2S SHINKAWA application areas:

The SHINKAWA MP-2S grinding and polishing machine is widely used in industries such as metal processing, optoelectronics, mold processing, and semiconductor manufacturing. For example, in the automotive manufacturing industry, fully automatic grinding and polishing machines are often used for processing automotive engine components such as crankshafts and connecting rods. In the aerospace field, this grinding and polishing machine can also be used for the manufacturing of aircraft components, such as aircraft engine blades.

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