LAM 810-073479-215 电路板模块线路板按层数来分的话分为单面板，双面板，和多层线路板三个大的分类。是单面板，在基本的PCB上，零件集中在其中-面，导线则集中在另–面上。因为导线只出现在其中-面,所以就称这种PCB叫作单面线路板。单面板通常制作简单，造价低，但是缺点是无法应用于太复杂的产品上。双面板是单面板的延伸，当单层布线不能满足电子产品的需要时，就要使用双面板了。双面都有要铜有走线，并且可以通过过孔来导通两层之间的线路，使之形成所需要的网络连接。多层板是指具有三层以上的导电图形层与其间的绝缘材料以相隔层压而成，且其间导电图形按要求互连的印制板。
810-073479-215
LAM 810-073479-215 电路板模块多层线路板是电子信息技术向高速度、多功能、大容量、小体积、薄型化、轻量化方向发展的产物。线路板按特性来分的话分为软板(FPC),硬板(PCB),软硬结合板(FPCB)。阻燃要铜箔酚醛纸层压板。阻燃覆铜箔环氧E玻纤布层压板及其粘结片材料。阻燃要铜箔改性或未改性环氧E玻纤布层压板及其粘结片材料。阻燃覆铜箔环氧/PPO玻璃布层压板及其粘结片材料。阻燃覆铜箔改性或未改性环氧玻璃布层压板及其粘结片材料。阻燃覆铜箔环氧E玻璃布层压板(用于催化加成法)。
810-073479-215
LAM 810-073479-215 circuit board module circuit boards can be divided into three major categories based on the number of layers: single panel, double-sided board, and multi-layer circuit board. It is a single panel, with parts concentrated on one side and wires concentrated on the other side on a basic PCB. Because wires only appear on one side, this type of PCB is called a single sided circuit board. Single panel production is usually simple and cost-effective, but the disadvantage is that it cannot be applied to products that are too complex. Double panel is an extension of a single panel, and when single-layer wiring cannot meet the needs of electronic products, double-sided boards are used. Both sides require copper with wiring, and the wiring between the two layers can be connected through vias to form the required network connection. Multilayer board refers to a printed board with three or more layers of conductive graphics and insulating materials between them, which are separated and laminated, and the conductive graphics between them are interconnected as required.
810-073479-215
LAM 810-073479-215 circuit board module multi-layer circuit board is a product of the development of electronic information technology towards high speed, multifunctional, large capacity, small volume, thinness, and lightweight. Circuit boards can be divided into soft board (FPC), hard board (PCB), and soft hard combination board (FPCB) based on their characteristics. Flame retardant requires copper foil phenolic paper laminate. Flame retardant copper foil epoxy E fiberglass cloth laminated sheet and its bonding sheet material. Flame retardant requires copper foil modified or unmodified epoxy E fiberglass cloth laminates and their bonding sheet materials. Flame retardant copper clad epoxy/PPO glass cloth laminate and its bonding sheet material. Flame retardant copper clad foil modified or unmodified epoxy glass cloth laminates and their bonding sheet materials. Flame retardant copper clad epoxy E-glass cloth laminated sheet (used for catalytic addition method).
810-073479-215
PLC控制器本身的硬件采用积木式结构，各厂家产品结构大同小异。以日本欧姆龙C200HE为例，为总线模板框式结构，基本框架(CPU母板)上装有CPU模板，其它槽位装有I/O模板;如果I/O模板多时，可由CPU母板经I/O扩展电缆连接I/O扩展母板，在其上装I/O模板;另一种方法是配备远程I/O从站等。这些都说明了PLC厂家将硬件各部件均向用户开发，便于用户选用，配置成规模不等的PLC，而且这种硬件配置的开放性，为制造商、分销商(代理商)、系统集成商、最终用户带来很多方便，为营销供应链带来很大便利，这是一大成功经验。
810-073479-215
There are no reviews yet.