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GE IC695PSD040F 数字输出模块 全系列CPU模块

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对于嵌入式安装适配器支架(IC695PSD040F),可以在接地连接到嵌入式安装适配器托架的情况下安装接地线。应安装一根额外的接地线,将适配器支架连接到坚实的底盘接地。 对于表面安装适配器支架(IC693ACC308),应将接地线从背板连接至机架上的坚实底盘接地。通用背板(IC695CHS012或CHS016)中的模块热插拔模块可在系统通电时安装或拆除。

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GE IC695PSD040F 数字输出模块 全系列CPU模块

对于嵌入式安装适配器支架(IC695PSD040F),可以在接地连接到嵌入式安装适配器托架的情况下安装接地线。应安装一根额外的接地线,将适配器支架连接到坚实的底盘接地。 对于表面安装适配器支架(IC693ACC308),应将接地线从背板连接至机架上的坚实底盘接地。通用背板(IC695CHS012或CHS016)中的模块热插拔模块可在系统通电时安装或拆除。这包括提供给模块的背板电源和现场电源。注意:对于支持热插拔的产品,模块必须在闩锁接合且所有引脚在2秒内连接的情况下正确固定在托架上.拆卸时,模块必须在2秒内完全脱离托架。在插入或移除过程中,模块不能保持部分插入,这一点很重要。模块的拆卸和插入之间必须至少间隔两秒。注意:当系统通电时,IC695PSD040F不能从通用背板上安装或卸下。在安装或卸下CPU之前,必须断开系统电源。

For the embedded installation adapter bracket (IC695PSD040F), a grounding wire can be installed with a ground connection to the embedded installation adapter bracket. An additional grounding wire should be installed to connect the adapter bracket to a solid chassis ground. For surface mounted adapter brackets (IC693ACC308), the grounding wire should be connected from the backplane to a solid chassis ground on the rack. The hot swappable modules in the universal backplane (IC695CHS012 or CHS016) can be installed or removed when the system is powered on. This includes the backplane power supply and on-site power supply provided to the module. Note: For products that support hot swapping, the module must be properly secured to the rack with the latch engaged and all pins connected within 2 seconds. When disassembling, the module must completely detach from the rack within 2 seconds. It is important that the module cannot maintain partial insertion during insertion or removal. The disassembly and insertion of modules must be separated by at least two seconds. Note: When the system is powered on, IC695PSD040F cannot be installed or removed from the universal backplane. Before installing or removing the CPU, the system power must be disconnected.

 

 

 

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