东芝集团创立于1875年,致力于为人类和地球的明天而努力奋斗,力争成为能创造丰富的价值并能为全人类的生活、文化作贡献的企业集团,东芝集团
业务领域包括数码产品、电子元器件、社会基础设备、家电等东芝模块TOSHIBA 2N3A3110-C安装调试确保2N3A3110-C在设定地址前完成电力
排线.2N3A3110-C先送内机电源再送外机电源，如果在开启室内机之前开启室外机，外机P.C.板 上7段显示码会显示E19,直至开启室内机电源。
2N3A8204-B
1、电路板组成
电路板主要由焊盘、过孔、安装孔、导线、元器件、接插件、填充、电气边界等组成。
各组成部分的主要功能如下：
焊盘：用于焊接元器件引脚的金属孔。
过孔：有金属过孔 和 非金属过孔，其中金属过孔用于连接各层之间元器件引脚。
安装孔：用于固定电路板。
导线：用于连接元器件引脚的电气网络铜膜。
接插件：用于电路板之间连接的元器件。
填充：用于地线网络的敷铜，可以有效的减小阻抗。
电气边界：用于确定电路板的尺寸，所有电路板上的元器件都不能超过该边界。
2N3A8204-B
2、电路板的维护
电路板在使用中，应定期进行保养，以确保电路板工作在良好的状态和减少电路板的故障率。具体分如下几种情况：
1、半年保养：
⑴每季度对电路板上灰尘进行清理，可用专用清洗液进行清洗，用吹风机吹干即可。
⑵观察电路中的电子元件有没经过高温的痕迹，电解电容有没鼓起漏液现象。
2、年度保养：
⑴对电路板上的灰尘进行清理。
⑵对电路板中的电解电容器容量进行抽检，如发现电解电容的容量低于标称容量的20%，应更换。
⑶对于涂有散热硅脂的大功率器件，应检查散热硅脂有没干固，将干固的散热硅脂清除后，涂上新的散热硅脂，以防止电路板中的大功率器件因散热不好而烧坏。
2N3A8204-B
1. Circuit board composition
The circuit board mainly consists of solder pads, via holes, installation holes, wires, components, connectors, fillers, electrical boundaries, etc.
The main functions of each component are as follows:
Solder pad: A metal hole used for soldering component pins.
Through hole: There are metal through holes and non-metal through holes, where metal through holes are used to connect component pins between layers.
Installation hole: used to fix the circuit board.
Wire: An electrical network copper film used to connect component pins.
Connector: A component used for connecting circuit boards.
Filling: Copper coating used for ground wire networks can effectively reduce impedance.
Electrical boundary: used to determine the size of a circuit board, and all components on the circuit board must not exceed this boundary.
2. Maintenance of circuit boards
The circuit board should be regularly maintained during use to ensure that it is in good condition and reduce the failure rate of the circuit board. Specifically, there are several situations as follows:
1. Half year maintenance:
(1) Clean the dust on the circuit board every quarter using a dedicated cleaning solution and blow dry with a hair dryer.
⑵ Observe whether the electronic components in the circuit have undergone traces of high temperature, and whether the electrolytic capacitor has bulged or leaked liquid.
2. Annual maintenance:
Clean the dust on the circuit board.
⑵ Conduct spot checks on the capacity of electrolytic capacitors in the circuit board. If it is found that the capacity of electrolytic capacitors is less than 20% of the nominal capacity, they should be replaced.
For high-power devices coated with heat dissipation silicone grease, it is necessary to check if the heat dissipation silicone grease is dry and firm. After removing the dry and firm heat dissipation silicone grease, new heat dissipation silicone grease should be applied to prevent high-power devices in the circuit board from burning out due to poor heat dissipation.
2N3A8204-B
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